Wafer Bonding

Name: Wafer Bonding
Brand: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
SKU: 9783642059155
Price: 1859.94 RON
Availability: InStock

Applications and Technology

Autor: Marin Alexe, Ulrich Gösele

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Legare: Carte broșată

Editura: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG

Disponibilitate: În depozitul extern

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The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCS...

Informații despre carte

Autor

Marin Alexe, Ulrich Gösele

Limbă

engleză

Legare

Carte - Carte broșată

Publicat

2011

Pagini

504

EAN

9783642059155

ISBN

3642059155

Enbook ID

01651230

Editura

Springer-Verlag Berlin and Heidelberg GmbH & Co. KG

Greutate

795

Dimensiuni

155 x 235 x 29

Descriere completă

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

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Wafer Bonding

Applications and Technology

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