SiP System-in-Package Design and Simulation

Mentor EE Flow Advanced Design Guide

Autor: Liu Yang

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Legare: Copertă tare

Editura: John Wiley and Sons Ltd

Disponibilitate: În depozitul extern

Expediem în 10-18 zile

736.33 lei

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design fl...

Informații despre carte

Autor

Liu Yang

Limbă

engleză

Legare

Carte - Copertă tare

Publicat

2017

Pagini

496

EAN

9781119045939

ISBN

9781119045939

Enbook ID

10918283

Editura

John Wiley and Sons Ltd

Greutate

896

Dimensiuni

252 x 177 x 30

Descriere completă

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.

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SiP System-in-Package Design and Simulation

Mentor EE Flow Advanced Design Guide

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