Semiconductor Wafer Bonding - Science and Technology

Autor: Q.Y. Tong, Ulrich Gosele

Limbă:

Legare: Copertă tare

Editura: John Wiley & Sons Inc

Disponibilitate: În depozitul extern

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A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and elect...

Informații despre carte

Autor

Q.Y. Tong, Ulrich Gosele

Limbă

engleză

Legare

Carte - Copertă tare

Publicat

1998

Pagini

320

EAN

9780471574811

ISBN

0471574813

Enbook ID

04892270

Editura

John Wiley & Sons Inc

Greutate

654

Dimensiuni

165 x 236 x 24

Descriere completă

A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more. This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding-including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others. For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.

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