RF and Microwave Microelectronics Packaging II

Name: RF and Microwave Microelectronics Packaging II
Brand: Springer International Publishing AG
SKU: 9783319847191
Price: 518.43 RON
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Autor: KEN KUANG

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Editura: Springer International Publishing AG

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518.43 lei

This book presents the latest developments in packaging for high-frequency electronics. It is a comp...

Informații despre carte

Autor

KEN KUANG

Limbă

engleză

Legare

Carte - Carte broșată

Publicat

2018

Pagini

172

EAN

9783319847191

ISBN

9783319847191

Enbook ID

19737758

Editura

Springer International Publishing AG

Greutate

2934

Dimensiuni

155 x 235 x 11

Descriere completă

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

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