Reliability Technology for Integrated Circuit Packaging

Name: Reliability Technology for Integrated Circuit Packaging
Brand: Springer-Verlag GmbH
SKU: 9789819538843
Price: 864.26 RON
Availability: InStock

Autor: Yunfei En, Si Chen

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Legare: Copertă tare

Editura: Springer-Verlag GmbH

Disponibilitate: În depozitul extern

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864.26 lei

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms,...

Informații despre carte

Autor

Yunfei En, Si Chen

Limbă

engleză

Legare

Carte - Copertă tare

Publicat

2026

Pagini

509

EAN

9789819538843

ISBN

981953884X

Enbook ID

49699488

Editura

Springer-Verlag GmbH

Greutate

1010

Descriere completă

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.

Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.

Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

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