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Carte Microelectronic Interconnections and Assembly G.G. Harman

Microelectronic Interconnections and Assembly

Autor: G.G. Harman, Pavel Mach
Limbă: engleză
Legare: Copertă tare
Editura: Springer Netherlands
Disponibilitate: În depozitul extern
Expediem în 10-18 zile
497.27 lei
The Workshop is devoted to the technical aspects of advanced interconnections and microassembly and...

Informații despre carte

Autor
G.G. Harman, Pavel Mach
Limbă
engleză
Legare
Carte - Copertă tare
Publicat
1998
Pagini
299
EAN
9780792351399
Enbook ID
01395740
Editura
Springer Netherlands
Greutate
621
Dimensiuni
160 x 240 x 23

Descriere completă

The Workshop is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the education issues needed to prepare students for work in these areas. The future direction that such technologies may take is also dealt with. §The basic issue is that the miniaturisation of electronic systems continues, and performance must continue to improve. The newest packages are often based on the selection of an appropriate interconnection method. Advances in chip-scale, chip-flip, and direct chip attachments are described. Although wire bonding currently dominates the market, the consensus is that flip chip interconnection will rapidly increase its market share. Tape automated bonding is also discussed, primarily for special applications. Solder metallurgy and flip chip production technology receive attention in several papers. Solderability, reliability and fatigue of the joints are modelled, and mechanical stresses resulting from temperature cycling are reported. §Multichip module and thick-film hybrid substrate interconnections are reported in several papers. These include thick and thin film metals, as well as low temperature polymer inks. Several papers describe diffusion and other metallurgical interactions in thick film surfaces.

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