Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990

Name: Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990
Brand: Cambridge University Press
SKU: 9781107408715
Price: 213.72 RON
Availability: InStock

Symposium Held April 10-12, 2007, San Francisco, California, U.S.A.

Autor: Qinghuang Lin, E. Todd Ryan, Wen-li Wu, Do Yeung Yoon

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Legare: Carte broșată

Editura: Cambridge University Press

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213.72 lei

In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass prod...

Informații despre carte

Autor

Qinghuang Lin, E. Todd Ryan, Wen-li Wu, Do Yeung Yoon

Limbă

engleză

Legare

Carte - Carte broșată

Publicat

2014

Pagini

358

EAN

9781107408715

ISBN

1107408717

Enbook ID

02439059

Editura

Cambridge University Press

Greutate

Dimensiuni

152 x 229 x 19

Descriere completă

In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange the latest advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addressed interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.

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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990

Symposium Held April 10-12, 2007, San Francisco, California, U.S.A.

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Descriere completă

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