Carte Lead-Free Soldering Jasbir Bath

Lead-Free Soldering

Autor: Jasbir Bath
Limbă: engleză
Legare: Carte broșată
Disponibilitate: În depozitul extern
Expediem în 5-8 zile
757.43 lei
The worldwide trend toward lead-free components and soldering is especially urgent in the European U...

Informații despre carte

Autor
Limbă
engleză
Legare
Carte - Carte broșată
Publicat
2010
Pagini
299
EAN
9781441940834
ISBN
1441940839
Enbook ID
01422607
Greutate
486
Dimensiuni
155 x 235 x 18

Descriere completă

The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.The push toward lead-free soldering in computers, cell phones and other electronic and electrical devices has taken on a greater urgency as laws have been passed or are pending in the United States, the European Union and Asia which ban lead-bearing solder. These new restrictions on hazardous substances are changing the way electronic devices are assembled, and specifically affect process engineering, manufacturing and quality assurance. §Lead-Free Soldering offers in a single volume a broad collection of practical techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources. The book includes the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia. §Written by recognized experts in both academia and industry, Lead-Free Soldering is a must-have guide for practicing engineers interested in the latest developments surrounding areas such as lead-free alloy properties, reflow, wave, rework , solder joint reliability, PCB laminates and surface finishes, and backward and forward compatibility.

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