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High Thermal Conductivity Materials

Name: High Thermal Conductivity Materials
Brand: Springer-Verlag New York Inc.
SKU: 9781441919564
Price: 679.92 RON
Availability: InStock

Autor: Subhash L. Shinde, Jitendra Goela

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Editura: Springer-Verlag New York Inc.

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The main objective of this book is to cover the basic understanding of thermal conduction mechanisms...

Informații despre carte

Autor

Subhash L. Shinde, Jitendra Goela

Limbă

engleză

Legare

Carte - Carte broșată

Publicat

2010

Pagini

271

EAN

9781441919564

ISBN

1441919562

Enbook ID

01420847

Editura

Springer-Verlag New York Inc.

Greutate

450

Dimensiuni

155 x 235 x 16

Descriere completă

The main objective of this book is to cover the basic understanding of thermal conduction mechanisms in various high thermal conductivity materials including diamond, cubic boron nitride, and also the latest material like carbon nanotubes.§The book is intended as a good reference book for scientists and engineers involved in addressing thermal management issues in a broad spectrum of industries.§Leading researchers from industry and academic institutions who are well known in their areas of expertise have contributed a chapter in the field of their interest.Thermal management has become a hot field in recent years due to a need to obtain high performance levels in many devices used in such diverse areas as space science, mainframe and desktop computers, optoelectronics and even Formula One racing cars! Thermal solutions require not just taking care of very high thermal flux, but also hot spots , where the flux densities can exceed 200 W/cm2.§High thermal conductivity materials play an important role in addressing thermal management issues. This volume provides readers a basic understanding of the thermal conduction mechanisms in these materials and discusses how the thermal conductivity may be related to their crystal structures as well as microstructures developed as a result of their processing history. The techniques for accurate measurement of these properties on large as well as small scales have been reviewed. Detailed information on the thermal conductivity of diverse materials including aluminum nitride (AlN), silicon carbide (SiC), diamond, as well as carbon nanotubes has been presented. The emphasis is on developing basic understanding of the inter-relationships between thermal conductivity and processing such that the readers can conduct their own research in this exciting field of high thermal conductivity materials. Engineers and scientists involved in addressing thermal management issues in a broad spectrum of industries should find this book a valuable resource in their work.

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