High Performance Design Automation For Multi-chip Modules And Packages

Name: High Performance Design Automation For Multi-chip Modules And Packages
Brand: World Scientific Publishing Co Pte Ltd
SKU: 9789810223076
Price: 550.52 RON
Availability: InStock

Autor: Paul D Franzon

Limbă:

Legare: Copertă tare

Editura: World Scientific Publishing Co Pte Ltd

Disponibilitate: șansă 50%

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550.52 lei

Today's electronics industry requires new design automation methodologies that allow designers to in...

Informații despre carte

Autor

Paul D Franzon

Limbă

engleză

Legare

Carte - Copertă tare

Publicat

1996

Pagini

264

EAN

9789810223076

ISBN

9810223072

Enbook ID

05065166

Editura

World Scientific Publishing Co Pte Ltd

Greutate

359

Descriere completă

Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages.

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