High-Frequency Characterization of Electronic Packaging, 1

Name: High-Frequency Characterization of Electronic Packaging, 1
Brand: Springer, Berlin
SKU: 9781461375739
Price: 524.05 RON
Availability: InStock

Autor: Luc Martens

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Editura: Springer, Berlin

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High-Frequency Characterization of Electronic Packaging will be of interest to researchers and desig...

Informații despre carte

Autor

Luc Martens

Limbă

engleză

Legare

Carte - Carte broșată

Publicat

2014

Pagini

158

EAN

9781461375739

ISBN

1461375738

Enbook ID

05181616

Editura

Springer, Berlin

Greutate

278

Dimensiuni

155 x 235 x 10

Descriere completă

High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.§High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.§High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.

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High-Frequency Characterization of Electronic Packaging, 1

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