Electronic Packaging Materials Science X: Volume 515

Name: Electronic Packaging Materials Science X: Volume 515
Brand: Materials Research Society
SKU: 9781558994218
Price: 133.78 RON
Availability: PreOrder

Autor: Daniel J. BeltonMichael GaynesElizabeth G. JacobsRaymond Pearson

Limbă:

Legare: Copertă tare

Editura: Materials Research Society

Disponibilitate: Retipărire preconizată

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133.78 lei

Advanced packaging applications are demanding increasingly more innovative materials sets in order t...

Informații despre carte

Autor

Daniel J. BeltonMichael GaynesElizabeth G. JacobsRaymond Pearson

Limbă

engleză

Legare

Carte - Copertă tare

Publicat

1998

Pagini

262

EAN

9781558994218

ISBN

1558994211

Enbook ID

02060166

Editura

Materials Research Society

Greutate

614

Dimensiuni

157 x 234 x 23

Descriere completă

Advanced packaging applications are demanding increasingly more innovative materials sets in order to ensure overall package reliability. In addition, as we migrate towards higher-density inter-connects, the assembly operation will require new processes and process materials to guarantee both performance and manufacturability. This book explores the questions of materials, processes and reliability for high-density package solutions. The book is strengthened by invited and contributed papers from a host of national and international experts. Topics include: interfacial adhesion behavior; flip-chip interconnections; high-density substrates; thermomechanical behavior and packaging reliability issues.

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Electronic Packaging Materials Science X: Volume 515

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