Deep Sciences for Computing and Communications

Name: Deep Sciences for Computing and Communications
Brand: Springer, Berlin
SKU: 9783031689079
Price: 551.23 RON
Availability: InStock

Second International Conference, IconDeepCom 2023, Chennai, India, April 20-22, 2023, Proceedings, Part II

Autor: Annie Uthra R, Kottilingam Kottursamy, Gunasekaran Raja, Ali Kashif Bashir, Utku Kose, Appavoo Revathi, Vimaladevi Madhivanan

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Editura: Springer, Berlin

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551.23 lei

This two-volume set, CCIS 2176-2177, constitutes the proceedings from the Second International Confe...

Informații despre carte

Autor

Annie Uthra R, Kottilingam Kottursamy, Gunasekaran Raja, Ali Kashif Bashir, Utku Kose, Appavoo Revathi, Vimaladevi Madhivanan

Limbă

engleză

Legare

Carte - Carte broșată

Publicat

2024

Pagini

503

EAN

9783031689079

Enbook ID

46549982

Editura

Springer, Berlin

Greutate

803

Dimensiuni

155 x 235

Descriere completă

This two-volume set, CCIS 2176-2177, constitutes the proceedings from the Second International Conference on Deep Sciences for Computing and Communications, IconDeepCom 2023, held in Chennai, India, in April 2023.

The 74 full papers and 8 short papers presented here were thoroughly reviewed and selected from 252 submissions. The papers presented in these two volumes are organized in the following topical sections:

Part I: Applications of Block chain for Digital Landscape; Deep Learning approaches for Multipotent Application; Machine Learning Techniques for Intelligent Applications; Industrial use cases of IOT; NLP for Linguistic Support; Convolution Neural Network for Vision Applications.

Part II: Optimized Wireless Sensor Network Protocols; Cryptography Applications for Enhanced Security; Implications of Networking on Society; Deep Learning Model for Health informatics; Web Application for Connected Communities; Intelligent Insights using Image Processing; Precision Flood Prediction Models.

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Deep Sciences for Computing and Communications

Second International Conference, IconDeepCom 2023, Chennai, India, April 20-22, 2023, Proceedings, Part II

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Descriere completă

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