Advances in Rapid Thermal and Integrated Processing

Name: Advances in Rapid Thermal and Integrated Processing
Brand: Springer Netherlands
SKU: 9789048146963
Price: 2201.15 RON
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Autor: F. Roozeboom

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Editura: Springer Netherlands

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Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor...

Informații despre carte

Autor

F. Roozeboom

Limbă

engleză

Legare

Carte - Carte broșată

Publicat

2010

Pagini

566

EAN

9789048146963

ISBN

9048146968

Enbook ID

01973611

Editura

Springer Netherlands

Greutate

803

Dimensiuni

160 x 240 x 29

Descriere completă

Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.

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Advances in Rapid Thermal and Integrated Processing

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