Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition

Autor: 
Limba: 
english
Tip copertă: 
Greu
Număr de pagini: 
576
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.The most com ...Descriere completă
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ISBN9780071821018
AutorVan Zant Peter
EdituraMcgraw Hill Book Co
Limbaenglish
Tip copertăPevná vazba
Anul publicării2013
Număr de pagini576

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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

The most complete, current guide to semiconductor processing

Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.

State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.

COVERAGE INCLUDES:

  • The semiconductor industry
  • Properties of semiconductor materials and chemicals
  • Crystal growth and silicon wafer preparation
  • Wafer fabrication and packaging
  • Contamination control
  • Productivity and process yields
  • Oxidation
  • The ten-step patterning process--surface preparation to exposure
    developing to final inspection
  • Next generation lithography
  • Doping
  • Layer deposition
  • Metallization
  • Process and device evaluation
  • The business of wafer fabrication
  • Devices and integrated circuit formation
  • Integrated circuits
  • Packaging

 

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